SiC Inverter Hloov ntawm 10-100 kHz: Vim li cas Busbar Parasitics Matter

Lub SiC inverter busbar tsis yog ib qho qis -cov neeg xyuas pib. Thaum lub sij hawm siab - zaus hloov, lub busbar tsim ib feem ntawm lub voj voog sib hloov, thiab nws cov kab mob cab inductance ncaj qha ua rau qhov hluav taws xob overshoot raws li V=L × di / dt. Rau EV traction inverters, lub hom phiaj tsim qauv yog feem ntau ua kom qhov siab -tam sim no txoj kev sib hloov qis dua 10 nH, thaum tuav tswj kev nkag siab, tshem tawm, qhov kub thiab txias thiab kev ua haujlwm siab.

 

Rau kev cai SiC Inverter Busbar Assembly, hluav taws xob, thermal thiab mechanical tsim yuav tsum tau tsim raws li ib tug qauv: C1100 tooj liab xaiv, laminated geometry, dielectric rwb thaiv tsev, laser los yog tsis kam welding, DC -Txuas kev sib txuas capacitor thiab tam sim no -sensor positioning tag nrho cuam tshuam rau qhov kawg switching -loop kev ua tau zoo.
 

 

 

SiC MOSFETs tuaj yeem hloov pauv sai dua li cov pa roj silicon IGBTs. Qhov tshwm sim siab di/dt nthuav tawm cov kab mob parasitic inductance uas tej zaum yuav muaj kev cuam tshuam tsawg dua hauv - zaus zog theem.

 

Lub induced voltage yuav qhia tau hais tias:

 

Vₗ=Lₚ × di/dt

Qhov twg:

Vₗ=parasitic inductive voltage
Lₚ=parasitic voj inductance
di/dt=tus nqi tam sim no

 

Piv txwv li, yog hais tias ib lub voj commutation muaj 20 nH ntawm parasitic inductance thiab tam sim no hloov ntawm 2 kA / µs, qhov inductive voltage pab yog kwv yees li 40 V.

 

Txo lub voj voog lub cev thiab tawm tsam cov teb sib nqus hauv cov pawg busbar tuaj yeem txo qhov kev hloov pauv tsis tau nce qhov ntsuas hluav taws xob semiconductor.

 

 

C1100/C11000 oxygen-dawb lossis electrolytic tawv-pitch tooj liab yog dav siv rau siab -tam sim no busbar kev tsim kho vim nws cov hluav taws xob conductivity thiab tsim muaj peev xwm.

 

Khoom siv	Hom conductivity	Main Advantage	Daim ntawv thov Busbar Hom
C1100 tooj	~ 97-100% IAB	Tsawg DC tsis kam	DC -Txuas thiab inverter zog txoj kev
C1020 Oxygen-Tooj liab dawb	~ 100% IAB	High conductivity, tsis tshua muaj oxygen cov ntsiab lus	Siab - cov khoom siv hluav taws xob tam sim no
C2680 tooj dag	25-30% IAB	Siab zog, formability	Terminals, brackets, kho vajtse
Aluminium 6061	~ 40% IAB	Low density, structural strength	Nyhav-sensitive conductors

 

Rau lub siab -tam sim no SiC inverter, C1100 tooj liab feem ntau yog xaiv rau thawj txoj hauv kev tam sim no, thaum tooj dag lossis plated steel yuav siv tau rau cov khoom siv kho tshuab uas muaj hluav taws xob conductivity yog theem nrab.

 

Copper thickness tsis raug xaiv los ntawm qhov ntsuas tam sim no ib leeg. Kev tsim qauv yuav tsum suav rau:

RMS tam sim no
mem tes tam sim no
lub luag hauj lwm voj voog
tso cai kub nce
ambient kub
cua txias interface
conductor dav thiab thickness
kev sib thooj
sib koom ua ke
plating thickness

 

 

Lub laminated busbar muaj ntau txheej txheej txheej sib cais los ntawm cov khoom siv dielectric. Dimensional variation nyob rau hauv txhua txheej tooj liab accumulates ntawm mounting qhov, davhlau ya nyob twg interfaces, thiab capacitor kev twb kev txuas cov ntsiab lus.

 

Rau precision Cheebtsam, kev tswj qhov ntev tuaj yeem tsim los ntawm:

Progressive tuag stamping
CNC thib ob machining
Hauv - tuag riveting
Npib
Precision dabtsi yog khoov
Laser txiav
Kev tshuaj xyuas CMM

Nyob ntawm cov duab geometry, qhov ntev ntawm qhov ntev ntawm ± 0.01-0.05 hli tuaj yeem ua tiav ntawm cov yam ntxwv tswj, thaum tag nrho cov tsim - ib feem kam rau ua yuav tsum tau txhais raws li cov khoom thickness, khoov vojvoog thiab cov cuab yeej siv.

 

Kev kos duab engineering yuav tsum paub qhov txawv ntawm:

 

Hluav taws xob interface qhov ntev
Mechanical nrhiav qhov ntev
Tsis yog- qhov ntev ua haujlwm
Flatness xav tau
Qhov chaw kam rau ua
Vuam datum xav tau

 

 

 

Qhov ua tau zoo tshaj plaws qis - cov qauv inductance feem ntau tau txais los ntawm kev tso tawm thiab rov qab txoj hauv kev tam sim no lub cev ze rau ib leeg.

 

Lub laminated qauv tuaj yeem tso qhov zoo thiab tsis zoo conductors nyob rau hauv cov khaubncaws sab nraud povtseg:

 

Cu (+) / Dielectric / Cu (−)

 

Cov lus qhia tawm tsam tam sim no tsim ib nrab tshem tawm cov hlau nplaum. Qhov no txo ​​cov voj voog cheeb tsam thiab yog li txo cov kab mob parasitic inductance.

 

Rau siab -ntau zaus busbar tsim, cov kev txwv hauv qab no yuav tsum tau siv hluav taws xob simulation thiab kuaj lub cev:

Tus neeg xyuas pib sib nrug
Tooj thickness
Txheej txheej
Terminal geometry
Kev taw qhia tam sim no
Overlap cheeb tsam
Ntawm qhov chaw los yog ntsia liaj qhov rooj
DC -Txuas qhov deb ntawm capacitor
Semiconductor module nrug
Qhov chaw sensor
Vaj tse clearance
 

 

Ua kom tooj liab tuab txo DC tsis kam, tab sis nws tsis tuaj yeem tsim qhov qis tshaj hloov pauv - voj inductance.

 

A 5 mm - phaj tooj liab tuab tseem tuaj yeem pom ntau lub voj inductance yog tias qhov zoo thiab qhov tsis zoo ntawm lub cev sib cais.

 

Tsim Parameter	Tsawg-Inductance Direction	Hluav taws xob vim li cas
Qhov zoo/tsis zoo sib nrug	Tsawg kawg	Txo qhov chaw voj voog
Tam sim no - txoj kev sib tshooj	Maximize	Txhim kho kev sib nqus- teb tshem tawm
DC -Txuas qhov deb ntawm capacitor	Tsawg kawg	Shortens commutation voj voog
Terminal kev hloov pauv	Compact	Txo cov inductive discontinuity hauv zos
Tooj thickness	Ua kom zoo	Tswj tsis kam thiab thermal loading
Khoov	Txo cov kev hloov pauv sai sai	Txo cov neeg coob coob tam sim no
Fastener qhov chaw	Nyob ze tam sim no interface	Txwv kev sib koom ua ke impedance

 

Cov tswv yim tsim lub hom phiaj yuav tsum tau tsim los ntawm inverter hloov ceev, semiconductor voltage ntsuam xyuas, tso cai overshoot, thiab ntsuas commutation waveform es tsis yog los ntawm ib tug generic inductance tooj.

 

 

Lub dielectric txheej ntawm tooj liab conductors yuav tsum tiv thaiv ob qho tib si txuas ntxiv DC voltage thiab rov ua dua hloov pauv hloov pauv.

 

Hom rwb thaiv tsev tsim variables muaj xws li:

 

PET zaj duab xis
PI film
Epoxy hmoov txheej
Polyimide systems
Moulded rwb thaiv tsev qauv

 

Qhov yuav tsum tau dielectric tiv taus theem nyob ntawm qhov system voltage, transient voltage, rwb thaiv tsev thickness, creepage, clearance thiab ib puag ncig tej yam kev mob.

 

A material specification such as dielectric breakdown strength >15 kV / mm yuav tsum tsis txhob raug kho raws li kev tsim rwb thaiv tsev tiav. Kev sib dhos ua tiav yuav tsum tau lees paub rau cov dielectric tiv taus, ib nrab tawm qhov uas siv tau, thermal aging thiab mechanical kev ncaj ncees.

 

 

Rau ib qho EV inverter ua haujlwm ntawm ntau pua volts DC, rwb thaiv tsev tsis tuaj yeem txiav txim siab los ntawm txheej tuab ib leeg.

Tus tsim yuav tsum xav txog:

 

Ua haujlwm voltage
Overvoltage qeb
Pollution degree
Cov khoom siv
Qhov siab
CTI
Creepage nrug
Clearance nrug
Hloov pauv hloov amplitude

 

UL 94 V-0 tuaj yeem txhais cov kev ua tau zoo ntawm cov khoom siv rwb thaiv tsev, tab sis nws tsis hloov hluav taws xob rwb thaiv tsev kev sib koom ua ke raws li cov txheej txheem tsim nyog xws li IEC 60664-1.

 

Thov Kev Ntsuam Xyuas DFM Dawb & Tso Cai

 

 

Lub SiC inverter busbar tuaj yeem ua haujlwm ntawm qhov nruab nrab qhov kub thiab txias thaum tsim cov chaw hauv cheeb tsam siab tshaj 200℃ze ntawm cov khoom siv, cov pob qij txha, lossis cov kev hloov pauv tam sim no nqaim.

 

Qhov teeb meem thermal feem ntau yog tshwm sim los ntawm kev ua haujlwm hauv cheeb tsam es tsis txaus tag nrho cov tooj liab hla -section.

Joule cua sov hauv qab no:

 

P = I²R

Ib qho kev nce me me hauv kev sib koom ua ke ua rau qhov tsis sib xws ntawm qhov kub thiab txias ntawm qhov siab tam sim no.

Piv txwv li, ntawm 500 A, kev sib koom ua ke ntawm tsuas yog 100 µΩ ua:

 

P = 500² × 0.0001 = 25 W

Qhov ntawd 25 W yog concentrated ntawm qhov sib cuam tshuam me me dua li faib thoob plaws tag nrho cov tooj liab busbar.

 

 

Rau siab - cov rooj sib txoos busbar tam sim no, kev sib koom ua ke yuav tsum tau tswj los ntawm cov txheej txheem muaj peev xwm es tsis yog kev soj ntsuam pom ib leeg.

Kev siv thev naus laus zis muaj xws li:

 

Laser vuam

Kuj welding

TIG welding

Brazing

Molecular diffusion vuam

Bolted hluav taws xob sib txuas

Riveted conductive interfaces

 

Kev Koom Tes	Hom Lub Zog	Thaum tshav kub kub-Teb chaws cuam tshuam	Dimensional Tswj	Tsim nyog thov
Laser vuam	Siab	Tsawg	Siab	Kub busbar terminals
Kuj welding	Siab	Localized	Siab	Tabs thiab nyias conductors
Rauv brazing	Siab	Dav thermal raug	Nruab nrab	Complex tooj liab sib dhos
Molecular diffusion vuam	Siab heev interface zoo	Tsawg heev	Siab	Precision laminated qauv
Bolted sib koom	Mechanical serviceable	Tsis muaj	Nruab nrab	Tshem tau kev sib txuas

 

Rau tooj liab-rau- tooj liab laser vuam, beam absorption qis dua rau ntau cov hlau. Surface condition, wavelength, power density, shielding gas, joint gap, and heat extraction therefore require process development.

 

 

Ib qho kev ua haujlwm validation yuav tsum sib txuas qhov ntev thiab thermal ntsuas.

Ib qho validation sequence muaj xws li:

 

CMM tshuaj xyuas ntawm lub davhlau ya nyob twg txoj hauj lwm thiab flatness.

Plaub -hloov ntsuas ntawm cov hluav taws xob sib txuas.

Thermocouple lossis RTD ntsuas ntawm qhov chaw teev tseg.

Infrared thermal imaging nyob rau hauv tus neeg sawv cev tam sim no.

Thermal cycling.

Dielectric tiv thaiv kev sim.

Weld cross-section soj ntsuam.

Destructive rub lossis shear kuaj qhov twg muaj.

 

Thermal imaging yuav tsum tsis txhob siv raws li ib qho kev lees txais vim hais tias emissivity txawv heev ntawm liab qab tooj liab, plated tooj liab, txheej, thiab oxidized nto.

 

 

Tooj liab muaj ib coefficient ntawm thermal expansion ntawm kwv yees li 16.5-17 ppm / degree. Polymer rwb thaiv tsev thiab cov khoom hlau uas nyob ib sab feem ntau muaj cov coefficient sib txawv.

 

Rov ua dua qhov kub thiab txias cycling yog li tsim kom muaj kev ntxhov siab ntawm kev siv tshuab:

welded interfaces
riveted interfaces
txheej ciam teb
terminal bolts
capacitor interfaces
sensor mounting cov ntsiab lus

 

Cov pawg busbar yuav tsum tau tsim los kom cov thermal expansion tsis hloov cov kev ntxhov siab ntau dhau mus rau hauv DC -Txuas cov kab hluav taws xob txuas lossis inverter semiconductor module.

 

 

 

Kev koom ua ke ntawm busbar nrog DC -Txuas txuas capacitor thiab lub ntsuas hluav taws xob tam sim no tuaj yeem ua rau lub voj voog hluav taws xob luv thiab txo cov suav suav.

Txawm li cas los xij, kev sib koom ua ke txhua yam qhia txog kev txwv ntxiv.

 

Lub busbar yuav tsum ua tib zoo txaus siab:

Hluav taws xob tam sim no muaj peev xwm
Tsawg stray inductance
Capacitor davhlau ya nyob twg alignment
Sensor aperture alignment
Sib nqus- teb tswj
Creepage thiab clearance
Tsev interface
Kev ua siab ntev
Kev pabcuam

 

 

DC-Txuas txuas capacitor yuav tsum nyob ze li qhov ua tau zoo rau theem hloov hluav taws xob.

 

Lub hom phiaj yog kom txo qhov siab - zaus sib hloov voj voog:

 

DC-Txuas txuas capacitor → zoo busbar → SiC module → tsis zoo busbar → DC-Txuas txuas capacitor

 

Ua kom lub cev nyob deb ntawm cov ntsiab lus no nce tus neeg xyuas qhov ntev thiab lub voj voog.

 

Vim li no, lub tsheb npav uas muaj hluav taws xob tsawg- tsis kam tab sis lub cev ntev tuaj yeem ua haujlwm tsis zoo thaum hloov SiC nrawm dua li kev tiv thaiv me ntsis tab sis nruj tsim laminated.

 

 

Cov sensors tam sim no tuaj yeem siv Hall-effect, fluxgate, shunt, lossis lwm yam thev naus laus zis.

 

Lub busbar geometry nyob ib ncig ntawm lub sensor yuav tsum tswj xyuas:

 

Tus coj txoj haujlwm
Sensor aperture tshem tawm
Sib nqus{0}} teb symmetry
Mechanical fixation
Rwb thaiv tsev sib nrug
Thermal cais

 

Rau shunt-raws li qhov ntsuas tam sim no, qhov ua haujlwm thiab qhov kub thiab txias coefficient ntawm shunt yog ib feem ntawm kev ntsuas ntsuas.

 

Rau cov khoom sib nqus tam sim no, tus neeg xyuas pib txoj hauj lwm txheeb ze rau qhov ntsuas qhov ntsuas tuaj yeem cuam tshuam rau qhov chaw sib nqus pom los ntawm lub sensor.

 

Lub busbar kev kos duab yuav tsum yog li ntawd suav nrog cov ntaub ntawv qhia meej meej ntawm cov ntaub ntawv pov thawj es tsis yog kev cia siab rau kev sib dhos dav dav.

 

 

Laser vuam zoo nyob ntawm qhov sib koom ua ke geometry.

 

Rau tooj liab busbar sib dhos, lub qhov rais txheej txheem yuav tsum tswj:

 

Qhov sib txawv

Kev huv ntawm qhov chaw

Tooj thickness

Plating mob

Laser zog

Vuam ceev

Beam txoj kab uas hla

Tsom xam qhov chaw

Tiv thaiv roj

Clamping siab

 

Lub weld ruaj khov yuav tsum tau lees paub los ntawm metallographic ntoo khaub lig- ntu es tsis yog qhov pom kev pom ib leeg.

 

Download Busbar Tsim Specification

 

 

Rau cov kev pab cuam tsheb, hluav taws xob ua haujlwm ib leeg tsis tsim kev npaj tsim khoom.

 

Ib pob khoom validation yuav muaj xws li:

DFMEA

PFMEA

Tswj Plan

Txheej Txheem Flow Diagram

MSA

SPC

Kev tshawb fawb txog peev xwm

Dimensional soj ntsuam daim ntawv qhia

Cov ntaub ntawv pov thawj

Weld validation

Cov ntaub ntawv tiv thaiv hluav taws xob

Dielectric tiv taus qhov tshwm sim

Cov txiaj ntsig ntsuas kub

IMDS-cov ntaub ntawv hais txog cov ntaub ntawv uas muaj feem xyuam

Ntim specification

Traceability cov ntaub ntawv

 

 

Qhov tseem ceeb -rau- cov yam ntxwv zoo yuav tsum raug txheeb xyuas ua ntej ntau lawm.

 

Cov yam ntxwv zoo li CTQ muaj xws li:

Qhov chaw
Terminal flatness
Tooj thickness
rwb thaiv tsev thickness
Weld nkag
Weld zog
Kev sib koom ua ke
Plating thickness
Dielectric tiv taus
Sensor alignment

 

Rau qhov ruaj khov - txheej txheem tsim khoom, cov neeg siv khoom tuaj yeem teev Cpk Ntau dua lossis sib npaug rau 1.33 lossis tus nqi siab dua rau cov yam ntxwv tseem ceeb.

Qhov kev xav tau tiag tiag yuav tsum ua raws li tus neeg siv khoom qhov kev pom zoo thiab kev tswj hwm txoj kev npaj es tsis siv ib qho kev muaj peev xwm thoob ntiaj teb.

 

 

Qhov twg nyiaj -plated interfaces tau teev tseg, plating thickness yuav tsum tau xyuas kom meej siv txoj kev ntsuas tsim nyog xws li XRF.

Ib qho tshwj xeeb nominal xws li 3-5 µm Ag plating yuav tsum tau nrog:

Base khoom specification

Underplate specification

Yam tsawg kawg hauv zos thickness

Kev ntsuas qhov chaw

Kev npaj nto

Adhesion yuav tsum tau

Corrosion yuav tsum tau

Rau cov tooj liab busbars, plating feem ntau yog siv rau cov cheeb tsam hluav taws xob uas tau hais tseg es tsis tuaj yeem hla cov khoom tiav.

 

 

Cov ntaub ntawv cov ntaub ntawv muab qhov chaw pib. Kev tsim khoom validation yuav tsum ntsuas lub busbar tiav.

Qhov kev xeem yuav muaj xws li:

 

Kuaj	Lub Hom Phiaj	Hom Control Point
Dielectric tiv taus	Hluav taws xob rwb thaiv tsev	Tsis muaj kev tawg
Rwb thaiv tsev tsis kam	Kev tswj cov dej paug	Cov neeg siv khoom specification
Kev sib koom ua ke	Hluav taws xob poob	µΩ- ntsuas qib
Thermal nce	Thaum tshav kub kub tiam	Txhais tam sim no / load
Weld cross-section	Fusion zoo	Kev nkag mus / tsis raug cai
Kev tshuaj xyuas CMM	Dimensional conformity	Teeb duab kam rau ua
Plating thickness	Tiv tauj durability	XRF ntsuas
Thermal cycling	Expansion durability	Txhais kub profile
Kev vibration	Mechanical durability	Tsheb / system profile

 

 

Ib txoj kab ntau lawm rau EV busbar cov rooj sib txoos yuav tsum tswj kom muaj kev taug qab los ntawm cov khoom siv los ntawm kev tshuaj xyuas zaum kawg.

 

Ib qho traceability chain yog:

 

Copper Coil → Stamping Lot → Forming → Vuam → Tu → Rwb thaiv tsev → Plating → Sib dhos → Hluav taws xob kuaj → Kev tshuaj xyuas zaum kawg

Cov ntaub ntawv txheej txheem tuaj yeem txuas mus rau ntau qhov ntau lawm, tshuab, cuab yeej siv, tus neeg teb xov tooj, thiab cov ntaub ntawv tshuaj xyuas.

 

 

Cov cuab yeej cuab tam yuav tsum pib nrog lub rooj sib txoos zaum kawg es tsis yog tsuas yog rov ua dua 2D profile.

 

Ua ntej tuag fabrication, engineering tshuaj xyuas yuav tsum soj ntsuam:

Sawb layout

Kev siv cov khoom siv

Noob nplej

Khoov kab ke

Springback

Piercing load

Kev ua haujlwm load

Cov cuab yeej steel xaiv

Hnav qhov chaw

Burr kev taw qhia

Datum zoo

Vuam fixture

Kev soj ntsuam fixture

 

Rau tooj liab busbars, burr kev taw qhia yuav ua tau hluav taws xob thiab mechanically tseem ceeb nyob rau hauv lub stamped ntug nyob ze rwb thaiv tsev los yog lwm yam conductor.

 

 

Cov cuab yeej lub neej tsis tuaj yeem lav tau los ntawm tus lej mob stroke.

Lub neej tiag tiag nyob ntawm:

tooj liab hardness

Sawb thickness

Txiav clearance

Punch geometry

Tuag khoom

Txheej

Xovxwm ceev

Lubrication

Ntu geometry

Kev tu ncua

Cov cuab yeej yuav tsum tau saib xyuas los ntawm kev txwv tsis pub hnav thiab kev tiv thaiv- cov txheej txheem kev tu es tsis yog cia siab rau kev suav cov hlab ntsha tawg.

 

 

Txoj kev txhim kho SiC busbar txhim khu kev ntseeg yuav tsum siv ob qho tib si simulation thiab ntsuas lub cev.

 

Cov txheej txheem engineering tuaj yeem tsim raws li:

 

Hluav taws xob Architecture → 3D Busbar Layout → Electromagnetic Simulation → Thermal Simulation → DFM → Tooling → Prototype → CMM → Weld Validation → Electrical Test → Thermal Test → PPAP

 

Lub ntsiab lus tseem ceeb yog qhov ntsuas kev sib dhos yuav tsum sib haum nrog cov qauv hluav taws xob qub.

 

Lub voj voog simulated 8 nH tsis txaus yog tias cov khoom siv sib dhos ntsuas 18 nH vim yog lub davhlau ya nyob twg geometry, mounting hardware, lossis connector hloov pauv uas tsis suav nrog tus qauv.

 

 

Cov qauv yuav tsum muaj xws li:

 

Copper conductors

Terminal kev hloov pauv

Welded cheeb tsam

Capacitor txuas cov ntsiab lus

Semiconductor module interface

Fasteners qhov twg hluav taws xob cuam tshuam

Rov qab txoj kev

Sensor qauv qhov twg nws cuam tshuam rau kev faib tam sim no

 

Rau siab - zaus tsom xam, ua tiav 3D electromagnetic qauv yog qhov zoo dua rau kev suav DC tsis kam yooj yim

 

 

Kev ntsuas kev tiv thaiv yuav tsum siv Kelvin plaub- txoj kev xaim uas tsis tshua muaj kev tiv thaiv.

Kev ntsuas yuav tsum qhia meej:

 

Kuaj tam sim no

Ntsuas cov ntsiab lus

Ambient kub

Busbar kub

Lub sijhawm ruaj khov

Tiv tauj configuration

 

Vim tias tooj liab tsis kam hloov nrog qhov kub thiab txias, cov ntaub ntawv tiv thaiv tsis muaj qhov ntsuas ntsuas kub tau txwv cov nqi engineering.

 

 

Kev Cai Copper Busbar rau EV Drive daim ntawv thov yuav tsum raug kho raws li cov khoom siv hluav taws xob, thermal, thiab cov khoom siv sib dhos ntau dua li cov khoom siv tooj liab.

 

Rau SiC traction inverters, engineering qhov tseem ceeb yog ntsuas tau:

<10 nH target for the defined high-frequency commutation loop
97-100% IACS tooj liab conductivity nyob ntawm qib
Tswj µΩ- theem sib koom ua ke
Hauv zos thermal muaj peev xwm tshaj 200℃qhov twg yuav tsum tau los ntawm lub kaw lus
Txhais dielectric zog thiab rwb thaiv tsev sib koom ua ke
± 0.01-0.05 hli tswj ntawm kev xaiv qhov tseeb qhov twg tus qauv tso cai
CMM-raws li kev txheeb xyuas qhov ntev
Metallographic weld validation
XRF plating -thickness pov thawj
IATF 16949 ntau lawm tswj
PPAP Qib 3 cov ntaub ntawv thaum tus neeg siv khoom tau teev tseg

 

Qhov tseeb busbar yog ib qho uas nws cov qauv hluav taws xob, thermal qauv, txheej txheem tsim khoom, thiab cov ntaub ntawv tshuaj xyuas converge rau tib qhov kev tsim qauv.

 

 

Cov ntaub ntawv dab tsi feem ntau suav nrog hauv PPAP Theem 3 pob rau EV SiC inverter busbar?

Ib pob PPAP Qib 3 feem ntau suav nrog PSW, cov duab kos, cov ntaub ntawv cov ntaub ntawv, cov txiaj ntsig ntawm qhov loj me, PFMEA, Tswj Kev Npaj, cov txheej txheem ntws, MSA, kev tshawb fawb txog kev muaj peev xwm, thiab cov ntawv ceeb toom siv tau.

 

Ntev npaum li cas T1 cov cuab yeej thiab cov qauv qauv siv rau kev cai tooj liab inverter busbar?

Lub voj voog T1 kev loj hlob tuaj yeem npaj tau nyob ib ncig ntawm 20-30 hnub, nyob ntawm cov duab geometry, kev nce qib-tuag nyuaj, vuam fixtures, cov khoom muaj thiab cov neeg siv khoom pom zoo kos duab.

 

Yuav ua li cas nyiaj plating thickness txheeb xyuas ntawm atooj liab busbar terminal?

Silver plating thickness feem ntau raug txheeb xyuas los ntawm XRF ntsuas ntawm qhov chaw kuaj xyuas. Daim duab kos yuav tsum qhia qhov tsawg kawg nkaus thickness, ntsuas cheeb tsam, substrate thiab underplate yuav tsum tau.