metallized ceramic Cheebtsam substrate: cov txheej txheem kev, txheej txheem paths thiab daim ntawv thov tsom xam

Raws li cov khoom siv tseem ceeb hauv kev ntim khoom siv hluav taws xob niaj hnub no, metallized ceramic substrates tau ua tiav cov khoom sib xyaw ua ke ntawm cov khoom ntawm ob cov ntaub ntawv los ntawm kev sib koom ua ke ntawm cov yeeb yaj kiab hlau mus rau qhov chaw ceramic. Nws cov qauv ua ke nrog cov rwb thaiv tsev siab thiab kub ua haujlwm ntawm cov ceramics nrog cov hluav taws xob zoo heev thiab thermal conductivity ntawm cov hlau, ua rau nws yog ib qho tseem ceeb rau cov ntawv thov xws li siab -cov khoom siv hluav taws xob, cov khoom siv optoelectronic siab heev thiab siab - kev ntseeg tau ntawm automotive electronics. Cov hauv qab no yuav muab cov txheej txheem sib xyaw ua ke ntawm metallized ceramic substrates los ntawm ntau qhov ntev xws li cov qauv kev, cov txheej txheem tseem ceeb, cov yam ntxwv ua haujlwm, thiab kev siv hauv kev lag luam.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Lub hauv paus ntawm metallized ceramic substrates yog kom ua tiav siab - lub zog thiab txhim khu kev qha kev sib txuas ntawm ob yam khoom sib txawv, ceramic thiab hlau. Nws lub hauv paus ntsiab lus tsis yog kev sib txuas ntawm lub cev yooj yim, tab sis cia siab rau kev sib txuas ntawm cov tshuaj lom neeg thiab cov tshuaj tiv thaiv diffusion ntawm lub interface. Vim tias cov ceramics muaj lub zog qis thiab tsis muaj tshuaj lom neeg, lawv nyuaj rau ntub thiab sib txuas nrog cov hlau zoo tib yam. Yog li ntawd, tus yuam sij rau cov txheej txheem yog ua kom tiav metallurgical bonding los ntawm kev qhia cov ntsiab lus nquag (xws li titanium, zirconium) los yog tsim cov eutectic kua theem (xws li tooj liab-oxygen eutectic), ua rau muaj tshuaj lom neeg cov tshuaj tiv thaiv ntawm lub interface los tsim cov txheej txheem hloov.

Ib tug raug Metallized Ceramic substrate muaj ib tug Sandwich qauv: lub ceramic substrate muab txhua yam kev txhawb nqa thiab rwb thaiv tsev, metallized hloov txheej nyob rau hauv nruab nrab paub txog kev sib txuas, thiab cov tuab hlau txheej (feem ntau tooj liab) nyob rau saum npoo assumes lub zog ntawm hluav taws xob conductivity, thermal conductivity thiab welding carrier. Cov ceramic no-rau- hlau sib xyaw tsim tsim los daws cov teeb meem thermal stress tshwm sim los ntawm qhov tsis sib haum xeeb ntawm thermal expansion coefficient (CTE) ntawm cov ntaub ntawv sib txawv, yog li txhim kho lub sij hawm ntev - kev ntseeg siab ntawm cov cuab yeej nyob rau hauv qhov kub thiab txias.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Cov txheej txheem metallization yog tus yuam sij rau kev txiav txim siab qhov ua tau zoo thiab tus nqi ntawm lub substrate. Tam sim no, cov txheej txheem thev naus laus zis tseem ceeb suav nrog cov txheej txheem tooj liab ncaj qha, nyias zaj duab xis thev naus laus zis thiab cov khoom siv hlau ua haujlwm.

Direct copper txheej (DBC) txheej txheem. Cov txheej txheem no yog ua los ntawm qhov kub thiab txias (txog 1065 degree) thiab nyob rau hauv ib qho kev tswj tsis tshua muaj pa oxygen ib feem ntawm lub siab, ua rau cov tshuaj tiv thaiv eutectic tshwm sim nyob rau saum npoo ntawm cov ntawv ci tooj liab thiab ceramic (xws li aluminium oxide lossis aluminium nitride). Nws cov tub ntxhais yog tsim los ntawm ib txheej ntawm Cu / O eutectic kua theem, uas tuaj yeem ntub cov ceramic thiab hnov ​​​​mob nrog nws los tsim cov txheej txheem hloov pauv ruaj khov (xws li CuAlO₂). Qhov zoo ntawm cov txheej txheem DBC yog cov txheej tooj liab yog tuab (txog 300 μm lossis ntau dua) thiab muaj zog tam sim no - nqa thiab cua sov- muaj peev xwm dissipation. Nws yog qhov tsim nyog rau siab - lub zog xwm txheej xws li IGBT modules rau tsheb fais fab.

 

Nyias zaj duab xis thiab electroplating (DPC) txheej txheem. Cov txheej txheem no ua ntej ua cov txheej txheem nanoscale hlau (xws li Ti / Cu) ntawm cov ceramic los ntawm lub cev vapor deposition (PVD) technology xws li magnetron sputtering, thiab tom qab ntawd thickens txheej tooj liab los ntawm cov qauv electroplating. Qhov zoo tshaj plaws ntawm cov txheej txheem DPC yog nws cov qauv siab raug (kab dav / qhov sib nrug mus txog 20 μm) thiab nws cov txheej txheem qis - kub, uas zam kev puas tsuaj rau cov khoom siv los ntawm qhov kub thiab txias. Nws yog tshwj xeeb tshaj yog haum rau kev tsim cov Precision Metallized Alumina Ceramic Cheebtsam thiab yog dav siv nyob rau hauv xov tooj cua zaus li thiab optical kev sib txuas lus modules uas yuav tsum tau high wiring ceev.

 

Active hlau brazing (AMB) txheej txheem. Cov txheej txheem AMB siv cov hlau nplaum uas muaj cov khoom siv xws li titanium thiab zirconium, uas yog cua sov hauv lub tshuab nqus tsev kom siab tshaj qhov melting point ntawm solder. Cov khoom siv tshuaj lom neeg ua rau lub ntsej muag ceramic los ua ib txheej nyias uas yog wettable los ntawm cov solder, yog li ua tiav qhov siab - lub zog sib txuas ntawm cov ceramic thiab hlau (feem ntau yog tooj liab tuab). Cov txheej txheem AMB muaj kev sib raug zoo siab heev thiab tshwj xeeb tshaj yog tsim rau kev tsim cov High Purity Alumina Precision Advanced Ceramic Metallization Parts, nrog rau cov cheeb tsam uas muaj kev ntseeg siab heev, xws li lub ntsiab tsav inverters rau lub zog tshiab.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Muaj peev xwm tswj xyuas thermal zoo: Ceramic substrates, tshwj xeeb tshaj yog txhuas nitride (AlN), muaj cov thermal conductivity zoo heev (txog 180 W / m·K) thiab tuaj yeem tshem tawm cov cua sov los ntawm cov nti. Nws cov thermal expansion coefficient sib tw ntawm semiconductor chips (xws li Si, SiC), txo qis thermal voj voog kev ntxhov siab thiab txuas ntxiv lub neej sib koom ua ke.

Cov khoom siv hluav taws xob zoo thiab cov khoom siv kho tshuab: Cov ceramic nws tus kheej muaj lub zog dielectric siab thiab tsis tshua muaj dielectric poob, thiab cov txheej tooj liab tsim los ntawm Metallization Ceramic rau saum npoo muab qhov qis - tsis kam conductive txoj kev. Qhov kev sib xyaw ua ke no ua kom ntseeg tau tias cov cuab yeej ua haujlwm ruaj khov nyob rau hauv qhov muaj zaus thiab qhov hluav taws xob siab. Nyob rau tib lub sijhawm, Metallized Ceramic substrate muaj lub zog txhua yam, qhov ruaj khov, kev tiv thaiv corrosion, thiab tuaj yeem hloov mus rau qhov chaw hnyav.

Tsim thiab tsim tau yooj yim: Cov txheej txheem Metallized Ceramic sib txawv muab ntau yam kev xaiv tsim. Los ntawm lub siab tam sim no - nqa peev xwm ntawm DBC, mus rau siab -txoj hlua ntawm DPC, mus rau ultra- kev ntseeg siab ntawm AMB, engineers tuaj yeem xaiv qhov zoo tshaj plaws Alumina Metallized Ceramics tov raws li cov khoom siv hluav taws xob, thermal, mechanical thiab nqi. Qhov no nteg lub hauv paus rau kev tsim thiab kev tsim khoom ntawm Precision Metallized Ceramics.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Peb tsom mus rau kev muab siab - zoometallized ceramic Cheebtsam, precision machining cov kev pab cuam thiab tau cog lus los tsim siab -kev ua tau zoo Metallized Alumina Ceramics rau cov khoom siv hluav taws xob rau peb cov neeg siv khoom. Txawm hais tias nws yog tus qauv substrate customization los yog complex precision metallized ceramic ua, peb tuaj yeem muab cov kev daws teeb meem los ntawm kev tsim cov khoom tiav los pab koj cov khoom ua tiav hauv siab -precision teb.